Tz3300 Polyimide Advanced Microfabrication Material

Ceramic-reinforced PI material: A new resin-based material with excellent micro-hole processing and high-temperature dimensional stability, suitable for SOCKET test sockets, probe cards, and PCB inspection fixtures.

• 70mm square x 4mm thick

• 100mm square x 6mm thick

• 200mm square x 10mm thick

• Custom orders available: Customers can specify thickness (>0.4mm)

• Maximum size available: 500mm square

199 8483 3918

Tz3300 Polyimide Advanced Microfabrication Material

Key Features

Capable of micro-hole machining with Pitch below 100μm. (Minimum aperture: 17μm)
Compatible with mechanical drilling and laser processing
Minimal machining burrs
Uses high heat-resistant PI with excellent dimensional stability
Excellent insulation performance, suitable for high-current equipment
PI material with low water absorption rate

Mechanical Drilling Performance

Capable of long-hole machining with line width of 120μm

Excellent micro-hole machining performance

No collapse of spacer plates and minimal burrs

Laser Processing Performance

· 30μm / side
· Spacer thickness: 7μm
· Precision of R5

· Φ20μm / pitch 26μm
· No burrs or debris

Product Performance Parameters

Performance Indicator	Condition	Unit	TZ3300
Flexural Strength		MPa	140
Flexural Modulus		GPa	4.4
Rockwell Hardness		—	R125
Dielectric Constant (Dk)	10GHz	—	3.4
Loss Tangent (Df)	10GHz	—	0.004
Volume Resistivity		Ω·m	4×10¹³
Surface Resistivity		Ω	3×10¹⁵
CTI		V	600
Water Absorption	4 Hours Immersion	%	0.06
CTE	50~200℃	ppm/℃	59