PI (polyimide polyimide) condensate: heat resistance: hot melt molding temperature 360~500°C cold resistance: -196°C

The TZ3300-L series has an ultra-low dielectric constant, making it a next-generation IC test substrate.

PPS crystalline resin has very high heat resistance (continuous service temperature 220°C), excellent mechanical strength, rigidity, flame retardancy, corrosion resistance, electrical properties, and dimensional stability. In recent years, it has gained a place in the market due to its excellent characteristics.

Ceramic-reinforced PI material 1 is suitable for SOCKET test bases, probe cards, PCB inspection fixtures, and new resin substrate materials with excellent micro-hole processing and high-temperature dimensional stability.

PAI is a non-crystalline resin that is a combination of polyimide with excellent heat resistance and mechanical strength and polyamide with good processability and strong toughness. It is characterized by heat resistance (continuous service temperature 250°C), high thermal deformation resistance (load bending temperature 278°C), mechanical properties (especially high tensile strength and impact resistance), fatigue resistance, flame retardancy, friction, wear characteristics, and excellent resistance to high pressure rupture.

Polyimide resin has the advantages of * short delivery * high quality * price stability, and each product has its own characteristics. Cypra: The standard grade of the Cypra range. There are examples