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Suzhou Mingrise Materials Technology Co., Ltd.
TZ3300-L Series Test Socket Low Dk Material

Ceramic-reinforced polyimide materials

for next-generation substrates for IC testing: unmatched low dielectric coefficient

199 8483 3918
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TZ3300-L Series Test Socket Low Dk Material
Key Features
  • Dk≈2.6 (10GHz) - One of the Lowest Levels in the Industry
  • Capable of Precision Drilling for Holes Below φ100μm
  • Excellent Dimensional Stability of PI with High Temperature Resistance
  • Superior Machinability: Versatile Forming for Diverse Applications
  • PI Material with Excellent Low Moisture Absorption
Product Performance Parameters
Performance Indicator Condition Unit L1 L2
Flexural Strength — MPa 125 124
Flexural Modulus — GPa 2.8 3.2
Dielectric Constant (Dk) 10GHz — 2.67 2.67
Dielectric Loss Tangent (Df) 10GHz — 0.0028 0.0035
CTI — V ≥600 550
Water Absorption 24-hour Immersion % 0.1 0.1
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